Precision Enclosure Engineering
3D enclosure design is the mechanical engineering of the housing around an electronic assembly: how it fits the PCB, seals against dust and water, dissipates heat and is manufactured. Hire PCB Designer designs protective housings for aerospace, medical and extreme-environment electronics, with IP-rated sealing, thermal management and CNC or 3D-printed prototypes.
Engineering capabilities
CNC-machined precision
Parametric design for accurate component fitment, with tolerance analysis so parts fit with real manufacturing variation.
IP-rated sealing
Environmentally sealed designs for harsh conditions, including O-ring groove optimisation and thermal potting integration.
CNC and 3D-printed prototypes
3D-printed and CNC-machined enclosures for fast validation of fit, sealing and thermal behaviour.
What enclosure design includes
Typical deliverables on an enclosure project. The exact scope is confirmed when we review your requirements.
Parametric 3D CAD model
A complete enclosure model built around your PCB outline, connectors, mounting points and cable exits.
Tolerance and fit analysis
Stack-up and clearance checks so the board, connectors and housing fit together after manufacturing.
Sealing design
Gasket and O-ring grooves, split-line and cable-gland details aimed at your target ingress-protection (IP) rating.
Thermal management
Heat paths from hot components to the housing, thermal interfaces and potting where needed.
Manufacturing-ready files
Models and drawings prepared for CNC machining or 3D printing, depending on the process you choose.
Prototype support
CNC or 3D-printed prototypes for validating the design before committing to production.
Typical enclosure design process
Capture requirements
We gather the PCB outline, connectors, environment, ingress-protection target, thermal load and manufacturing method.
Concept and layout
We propose a housing concept, part split and mounting approach, and agree keep-out zones with the PCB design.
Detailed CAD
Full parametric model with sealing features, thermal paths and tolerance analysis.
Prototype and validate
A 3D-printed or CNC-machined prototype is used to check fit, sealing and thermal behaviour.
Release for manufacturing
Final files are prepared for your chosen production process.
Standards and methods
- IEC 60529 (IP code)
- The international standard that defines ingress-protection ratings such as IP54, IP65 and IP67 for dust and water.
- IP67
- Dust-tight (6) and protected against temporary immersion (7). Achieved through gaskets, O-rings and sealed cable entries.
- Manufacturing methods
- CNC machining and 3D printing for prototypes and low volumes, with design choices adapted to each process.
- Thermal interfaces
- Thermal pads, potting compound and housing-as-heat-sink strategies for moving heat out of the electronics.
Enclosure design FAQ
What is 3D enclosure design for electronics?
3D enclosure design is the mechanical CAD work of creating the housing around an electronic assembly. It covers fit around the PCB, connector and button cut-outs, mounting, sealing, heat dissipation and the manufacturing method, such as CNC machining or 3D printing. A good enclosure protects the electronics and is designed together with the board, not after it.
What does an IP67 rating mean?
IP67 is a rating defined by the IEC 60529 standard. The first digit, 6, means the enclosure is dust-tight. The second digit, 7, means it withstands temporary immersion in water, specified as up to 1 metre for 30 minutes. Reaching it depends on sealing details such as gasket or O-ring grooves, which we design into the housing.
Should I prototype with CNC machining or 3D printing?
3D printing is well suited to quick, low-cost iteration on shape and fit, and handles complex geometry easily. CNC machining gives tighter tolerances and production-like materials and surface finish, which matters for sealing surfaces and metal housings. Many projects print early prototypes, then move to CNC for final validation. We design for whichever process you choose.
How do you handle heat inside an enclosure?
Thermal management is considered during the mechanical design rather than added later. Depending on the power dissipated, that can include conducting heat from hot components to the housing through thermal interfaces, using the enclosure itself as a heat sink, and thermal potting where it suits the design. The approach is chosen against your power levels and sealing requirements.
How do you make sure the enclosure fits my PCB?
We work from the board outline, mounting holes, connector positions and component heights, and run tolerance analysis so parts fit with realistic manufacturing variation. Because Hire PCB Designer also does PCB layout, mechanical constraints such as keep-out zones and connector placement can be settled with the board design, avoiding costly late changes.
How much does enclosure design cost?
Cost depends on the enclosure complexity, sealing and thermal requirements, the number of parts, and the chosen manufacturing process. We do not publish a flat price. Send your requirements through the contact page, and we will review them and provide a quote based on the actual scope of work.
Related services
PCB Design & Layout
High-speed, multilayer, rigid-flex and HDI PCB layout with impedance control and DFM/DFA review.
Turnkey Manufacturing Support
PCBA and box-build assembly, supply-chain sourcing and functional test (ICT, flying probe).
Firmware Development
Bare-metal and RTOS embedded firmware for latency-critical and IoT devices.
Talk to us about your enclosure
Share your PCB outline, environment and sealing target and we will review them and come back with a scoped quote.